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0.25mm BGA Clip Ball IC Solder Steel Arrangement Template Cell Phone Repair Tool

Model: M2012

Price: $7.00    Always Free Shipping

Will ship out within 1 - 3 business days
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digg it

Product Details

  • Shipping Weight: 120g

Product Description



  • This is a Cell Phone Repair Tool for professional
  • This BGA Arrangement Template used for solder BGA clip balls/ Cell phone IC/ Cell phone CPU
  • Made of high quality stainless steel sheet materials
  • The small grids are molded by laser, durable and not easy to distort when be heated
  • This BGA Clip Ball Solder Template contains many types of cell phone’s BGA clip ball template, such as Motorola V3/V3i flash, Motorola V3x flash, Siements C55 flash, Nokia 7650 MF, Motorola V66 flash, Samsung V208 IC, Nokia 3510 CPU, Nokia 8810 CPU, ect
  • This IC Solder Template will help you to save your material in the repair process
  • Only suitable for professional use, the solder work is not easy, please make sure that you can do it by yourself before your purchase
  • Thickness: 0.25mm
  • Total size: about 245 x 95 x 0.25mm (L x W x H)
  • Weight: 28g

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This product was added to our catalog on Friday 02 January, 2009.

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Thank You

good communication fast free shipping worldwire. thanks

excellent service thankyou

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tres bien

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