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T-25 0.25mm Stainless Steel BGA Net Planting Kit for Motorola Series

Model: M2336

Price: $6.00    Always Free Shipping

Will ship out within 1 - 3 business days
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Product Details

  • Shipping Weight: 120g

Product Description



  • This BGA Net is a 22 set matrix which is needed Cell Phone Repair Tool when you have to exchange BGA parts of your phone
  • The BGA Planting Kit supports 0.65-30x30, 0.65-24x24, 998/v70 RAM, 0.65-18x18, 0.8-17x17, 0.65-4x16, V3 bluetooth, V3 UEM, V3i UEM, 6226 CPU, 6219 CPU, 6218 CPU, 6217 CPU, V3 flash, V3 CPU, 0.5-27x 27, 0.5-30x30, 0.5-24x24, 0.5-18x18, 0.5-10x10, 0.5-4x10 chipsets
  • Made of high quality stainless steel sheet materials
  • The small grids are molded by laser, durable and not easy to distort when be heated
  • Only suitable for professional use, the solder work is not easy, please make sure that you can do it by yourself before your purchase
  • Notice: cell phone IC/ CPU/ BGA is not included
  • Thickness: 0.25mm
  • Total size: about 223x 48 x 0.25mm (L x W x H)
  • Weight: 25g

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This product was added to our catalog on Friday 02 January, 2009.

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